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Why 2D materials matter for chips

Modern chips rely on multiple layers of different materials working together. As devices shrink, every layer must become thinner without losing functionality, a major challenge for conventional materials. Unlike most 3D materials, 2D TMCs retain their properties even when reduced to a single atomic layer, making them ideal candidates for ultra-thin chip components.

Deijkers investigated how to grow high-quality layers of TMCs such as TaS_â‚“ and MoS_â‚‚, using techniques like atomic layer deposition (ALD) and metalorganic chemical vapor deposition (MOCVD). These methods allow precise control over thickness and crystallinity, critical factors for reliable chip performance.

Atomic-scale growth and control

For TaS_â‚“, Deijkers developed an ALD process that enables tuning between amorphous and nanocrystalline phases by adjusting plasma composition. For MoS_â‚‚, she demonstrated conformal growth in complex 3D chip structures, ensuring uniform coverage even on sharp corners and trenches.

She also explored MOCVD growth of MoS_₂ using an alternative sulfur precursor, identifying an optimal temperature range (600–700 °C) for producing large, high-quality crystals without unwanted metal deposition.

Blocking copper diffusion in interconnects

One key application of 2D TMCs is as copper diffusion barriers in chip interconnects. Copper is widely used for signal transmission, but if it spreads uncontrollably, it can cause short circuits. Deijkers showed that ALD-grown MoS_₂ effectively blocks copper diffusion, provided the layer is thick enough (≥2.2 nm) and crystalline. Similar tests were performed with WS₂ and TaS_ₓ, confirming the importance of crystallinity for barrier performance.

Toward reliable nanoelectronics

By establishing and testing atomic-scale deposition and etching processes for TMCs, Deijkers’ work brings the semiconductor industry closer to integrating these materials into future chips. Her findings offer a roadmap for scalable, high-quality growth of 2D materials, supporting faster, smaller, and more energy-efficient electronics.